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LFE2M35SE-6FN256I - Lattice Semiconductor

Description: FPGA - Field Programmable Gate Array 34K LUTs S-Ser SERDE S Mem DSP 1.2V -6 I

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LFE2M35SE-6FN256I - Lattice Semiconductor PCB footprint - BGA - BGA - 256-FPBGA 17x17
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LFE2M35SE-6FN256I - Lattice Semiconductor  - 3D model - BGA - 256-FPBGA 17x17
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LFE2M35SE-6FN256I Details

  • Manufacturer Part Number:

    LFE2M35SE-6FN256I

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    FPBGA-256

  • Pin Count:

    256

  • Country Of Origin:

    Malaysia, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    9

  • Clock Frequency-Max:

    357 MHz

  • Combinatorial Delay of a CLB-Max:

    0.331 ns

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    4250

  • Number of Inputs:

    140

  • Number of Logic Cells:

    34000

  • Number of Outputs:

    140

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4250 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.1 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    17 mm

LFE2M35SE-6FN256I Frequently Asked Questions (FAQs)

  • The LFE2M35SE-6FN256I FPGA has an industrial temperature range of -40°C to 100°C, making it suitable for use in a wide range of applications.
  • The LFE2M35SE-6FN256I FPGA has a dedicated clock management system that allows for the creation of a clock tree using the ispLEVER or Lattice Diamond design software. The clock tree can be implemented using the FPGA's internal clock generators, phase-locked loops (PLLs), and clock buffers.
  • The maximum frequency that can be achieved with the LFE2M35SE-6FN256I FPGA depends on the specific design and implementation. However, the FPGA has a maximum clock frequency of 500 MHz, and the actual frequency achieved will depend on the design's complexity, routing, and other factors.
  • The I/O banks of the LFE2M35SE-6FN256I FPGA can be configured using the ispLEVER or Lattice Diamond design software. The software allows for the selection of I/O standards, voltage levels, and other parameters to match the specific requirements of the application.
  • The power consumption of the LFE2M35SE-6FN256I FPGA depends on the specific design and implementation. However, the FPGA has a typical static power consumption of 100 mW, and the dynamic power consumption will depend on the clock frequency, toggle rate, and other factors.

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LFE2M35SE-6FN256I Overview

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Part Image LFE2M35SE-6FN256C Lattice Semiconductor Corporation

Field Programmable Gate Array, 750 CLBS, 357MHz, 35000-Cell, PBGA256