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LFEC20E-3FN484C - Lattice Semiconductor

Description: IC FPGA 360 I/O 484FBGA

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PCB Footprints
LFEC20E-3FN484C - Lattice Semiconductor PCB footprint - BGA - BGA - 484-Ball fpBGA
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3D Models
LFEC20E-3FN484C - Lattice Semiconductor  - 3D model - BGA - 484-Ball fpBGA
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LFEC20E-3FN484C Details

  • Manufacturer Part Number:

    LFEC20E-3FN484C

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Pin Count:

    484

  • ECCN Code:

    3A991.D

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    420 MHz

  • Combinatorial Delay of a CLB-Max:

    0.56 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2464

  • Number of Inputs:

    360

  • Number of Logic Cells:

    19700

  • Number of Outputs:

    360

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    2464 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    23 mm

LFEC20E-3FN484C Frequently Asked Questions (FAQs)

  • Lattice provides a PCB layout guide and reference design files for the LFEC20E-3FN484C, which can be found on their website. It's recommended to follow these guidelines to ensure optimal signal integrity and minimize noise.
  • Lattice recommends a specific power-up and power-down sequence to ensure proper device operation. This sequence can be found in the device's datasheet or application notes. It's essential to follow this sequence to prevent damage to the device or other components on the board.
  • The LFEC20E-3FN484C has a maximum junction temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat dissipation through proper PCB design, thermal vias, and heat sinks. Lattice provides thermal management guidelines in the device's datasheet and application notes.
  • Lattice provides a range of tools and resources, including the Lattice Diamond design software, to help optimize the device's performance for specific applications. Engineers can use these tools to optimize the device's configuration, clocking, and routing for their particular use case.
  • The LFEC20E-3FN484C is a commercial-grade device, and its radiation tolerance and reliability characteristics are not explicitly specified. However, Lattice provides information on the device's reliability and radiation tolerance in the datasheet and application notes. For high-reliability or radiation-hardened applications, engineers should consider using a different device or consulting with Lattice's technical support team.

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LFEC20E-3FN484C Overview

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Part Image LFEC20E-3F484I Lattice Semiconductor Corporation

Field Programmable Gate Array, 2464 CLBs, 420MHz, 19700-Cell, PBGA484

Part Image LFEC20E-3F484C Lattice Semiconductor Corporation

Field Programmable Gate Array, 2464 CLBs, 420MHz, 19700-Cell, PBGA484

Part Image LFEC20E-3FN484I Lattice Semiconductor Corporation

Field Programmable Gate Array, 2464 CLBs, 420MHz, 19700-Cell, PBGA484