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LFSC3GA80E-7FFN1152C - Lattice Semiconductor

Description: FPGA - Field Programmable Gate Array 80.1K LUTs 660 I/O SERDES 1.2V -7SP

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LFSC3GA80E-7FFN1152C - Lattice Semiconductor PCB footprint - BGA - BGA - 1152-Ball Organic fcBGA
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LFSC3GA80E-7FFN1152C - Lattice Semiconductor  - 3D model - BGA - 1152-Ball Organic fcBGA
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LFSC3GA80E-7FFN1152C Details

  • Manufacturer Part Number:

    LFSC3GA80E-7FFN1152C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    35 X 35 MM, LEAD FREE, FCBGA-1152

  • Pin Count:

    1152

  • ECCN Code:

    3A991.D

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    156.25 MHz

  • Combinatorial Delay of a CLB-Max:

    0.152 ns

  • JESD-30 Code:

    S-PBGA-B1152

  • Length:

    35 mm

  • Number of CLBs:

    308

  • Number of Equivalent Gates:

    80000

  • Number of Inputs:

    660

  • Number of Logic Cells:

    80100

  • Number of Outputs:

    660

  • Number of Terminals:

    1152

  • Operating Temperature-Max:

    70 °C

  • Organization:

    308 CLBS, 80000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1152,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

LFSC3GA80E-7FFN1152C Frequently Asked Questions (FAQs)

  • Lattice provides a PCB Design and Layout Guide (PDF) that offers guidelines for PCB layout, routing, and signal integrity. It's recommended to follow these guidelines to ensure optimal performance and signal quality.
  • Lattice recommends using a multi-layer PCB with a dedicated power plane and following the Power Distribution Network (PDN) guidelines in the datasheet. Additionally, using a high-quality voltage regulator and decoupling capacitors can help ensure a reliable power supply.
  • The LFSC3GA80E-7FFN1152C has a thermal design power (TDP) of 1.5W. To manage thermal performance, use a heat sink or thermal interface material, and ensure good airflow around the device. Lattice also provides thermal modeling and simulation tools to help with thermal design.
  • Lattice provides extensive documentation and tutorials on using the Lattice Diamond software for FPGA design, implementation, and programming. The software includes a user guide, tutorials, and online support resources to help with the design flow.
  • The LFSC3GA80E-7FFN1152C has built-in security features such as TransFR (Transitional Fault Resistant) and Secure Configuration to prevent unauthorized access and tampering. Lattice also provides guidelines and recommendations for secure design practices and implementation.

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LFSC3GA80E-7FFN1152C Overview

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Part Image LFSC3GA80E-7FC1152C Lattice Semiconductor Corporation

Field Programmable Gate Array, 308 CLBs, 80000 Gates, 156.25MHz, 80100-Cell, CMOS, PBGA1152

Part Image LFSC3GA80E-7FF1152C Lattice Semiconductor Corporation

Field Programmable Gate Array, 308 CLBs, 80000 Gates, 156.25MHz, 80100-Cell, CMOS, PBGA1152