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LFSCM3GA15EP1-5FN900I - Lattice Semiconductor

Description: FPGA - Field Programmable Gate Array 15.2K LUTs MACO 3G SERDES 1.2V -5 Spd I

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LFSCM3GA15EP1-5FN900I - Lattice Semiconductor PCB footprint - BGA - BGA - 900-Ball fpBGA-2
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LFSCM3GA15EP1-5FN900I - Lattice Semiconductor  - 3D model - BGA - 900-Ball fpBGA-2
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LFSCM3GA15EP1-5FN900I Details

  • Manufacturer Part Number:

    LFSCM3GA15EP1-5FN900I

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    31 X 31 MM, LEAD FREE, FPBGA-900

  • Pin Count:

    900

  • ECCN Code:

    3A991.D

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    139.8 MHz

  • Combinatorial Delay of a CLB-Max:

    0.192 ns

  • JESD-30 Code:

    S-PBGA-B900

  • JESD-609 Code:

    e1

  • Length:

    31 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    56

  • Number of Equivalent Gates:

    15000

  • Number of Inputs:

    300

  • Number of Logic Cells:

    15200

  • Number of Outputs:

    300

  • Number of Terminals:

    900

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    56 CLBS, 15000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA900,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    31 mm

LFSCM3GA15EP1-5FN900I Frequently Asked Questions (FAQs)

  • Lattice provides a PCB Design and Layout Guide (UG057) that offers guidelines for PCB layout, routing, and signal integrity. It's recommended to follow these guidelines to ensure optimal performance and signal quality.
  • Lattice recommends using an external POR circuit with a voltage supervisor IC, such as the TLV7031, to ensure a reliable power-on reset. The datasheet provides a reference design for this circuit.
  • The LFSCM3GA15EP1-5FN900I has a thermal design power (TDP) of 1.5W. To manage thermal performance, Lattice recommends using a heat sink, thermal interface material, and following the thermal management guidelines in the datasheet.
  • Lattice provides a Clocking and PLL User Guide (UG055) that explains how to configure the FPGA's clocking and PLLs using the Lattice Diamond software. The guide covers clock domain crossing, PLL configuration, and clock tree synthesis.
  • The LFSCM3GA15EP1-5FN900I has built-in security features such as AES encryption, secure boot, and bitstream encryption. Lattice recommends following the Security User Guide (UG056) to implement these features and ensure secure device operation.

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LFSCM3GA15EP1-5FN900I Overview

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Part Image LFSCM3GA15EP1-5FN900C Lattice Semiconductor Corporation

Field Programmable Gate Array, 56 CLBs, 15000 Gates, 139.8MHz, 15200-Cell, CMOS, PBGA900