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LFXP2-30E-5FT256C - Lattice Semiconductor

Description: 30K LUTS, 201 I/O, INSTANT-ON,

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LFXP2-30E-5FT256C - Lattice Semiconductor PCB footprint - BGA - BGA - 256 FTBGA
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LFXP2-30E-5FT256C - Lattice Semiconductor  - 3D model - BGA - 256 FTBGA
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LFXP2-30E-5FT256C Details

  • Manufacturer Part Number:

    LFXP2-30E-5FT256C

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    FBGA-256

  • Pin Count:

    256

  • ECCN Code:

    3A991.D

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    435 MHz

  • Combinatorial Delay of a CLB-Max:

    0.494 ns

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    201

  • Number of Logic Cells:

    29000

  • Number of Outputs:

    201

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Organization:

    3635 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.1 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

LFXP2-30E-5FT256C Frequently Asked Questions (FAQs)

  • Lattice provides a PCB design guide and layout recommendations in their documentation, including the 'LatticeXP2 FPGA Family Data Sheet' and 'LatticeXP2 High-Density FPGA PCB Design Guide'. Additionally, they offer a free PCB design tool, Lattice Diamond, which includes a PCB design wizard to help with layout and routing.
  • Lattice recommends using a clock tree architecture with a central clock hub and regional clock buffers to minimize skew and jitter. They also provide guidelines for clock domain crossing and clock gating in their documentation. Additionally, the Lattice Diamond design software includes clocking wizards and tools to help with clock implementation.
  • Lattice provides power consumption estimates and thermal management guidelines in their documentation, including the 'LatticeXP2 FPGA Family Data Sheet' and 'LatticeXP2 FPGA Power Management Guide'. They also offer a power analysis tool, Lattice Power Calculator, to help estimate power consumption and plan for thermal management.
  • Lattice recommends using a secure configuration scheme, such as AES encryption and authentication, to protect the FPGA configuration data. They also provide guidelines for secure configuration and boot mechanisms in their documentation. Additionally, the Lattice Diamond design software includes tools and wizards to help with secure configuration implementation.
  • Lattice offers a range of development tools and software, including the Lattice Diamond design software, Lattice Radiant software, and Lattice Propel software. These tools provide a comprehensive development environment for designing, implementing, and testing FPGA-based systems.

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LFXP2-30E-5FT256C Overview

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Part Image LFXP2-30E-5FT256I Lattice Semiconductor Corporation

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