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LL4150GS08 - Vishay

Description: Diodes - General Purpose, Power, Switching Vr/50V Io/300mA T/R

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PCB Footprints
LL4150GS08 - Vishay PCB footprint - Other - Other - MiniMELF (SOD-80)_Thickness=1.6mm
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LL4150GS08 Details

  • Manufacturer Part Number:

    LL4150GS08

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-80, MELF-2

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Application:

    FAST RECOVERY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    O-LELF-R2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    4 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.3 A

  • Package Body Material:

    GLASS

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    50 V

  • Reverse Current-Max:

    100 µA

  • Reverse Recovery Time-Max:

    0.004 µs

  • Reverse Test Voltage:

    50 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    WRAP AROUND

  • Terminal Position:

    END

  • Time@Peak Reflow Temperature-Max (s):

    30

LL4150GS08 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package is recommended for optimal thermal performance. A copper pour on the PCB with multiple vias to a solid ground plane is also recommended to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
  • A soldering profile with a peak temperature of 260°C and a dwell time of 10-30 seconds is recommended. Avoid exceeding 280°C to prevent damage to the device.
  • Handle the device with ESD-protective equipment and follow proper ESD handling procedures. Use an ESD-protective wrist strap or mat, and ensure that the device is stored in an ESD-protective package.
  • Store the device in a dry, cool place (less than 30°C and 60% RH). Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.

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LL4150GS08 Overview

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