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LM20143QMHX/NOPB - Texas Instruments

Description: Automotive Grade 2.95-5.5V, 3A, Current Mode Synchronous Buck Regulator with Adjustable Frequency

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LM20143QMHX/NOPB - Texas Instruments - PCB symbol
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LM20143QMHX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PWP0016A PowerPAD HTSSOP - 1.2 mm max height
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LM20143QMHX/NOPB - Texas Instruments - 3D model - Small Outline Packages - PWP0016A PowerPAD HTSSOP - 1.2 mm max height
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LM20143QMHX/NOPB Details

  • Manufacturer Part Number:

    LM20143QMHX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    OUTPUT VOLTAGE IS ADJUSTABLE FROM 0.8 TO 3.3V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.95 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Max:

    5 V

  • Output Voltage-Min:

    0.8 V

  • Output Voltage-Nom:

    2.7 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1500 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LM20143QMHX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer to minimize thermal resistance. A thermal pad on the bottom of the package should be connected to the ground plane.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the output current and voltage according to the thermal derating curve provided in the datasheet. Additionally, ensure good airflow and thermal conduction to the heat sink.
  • Texas Instruments recommends using a 10uF to 22uF ceramic capacitor at the input and a 10uF to 22uF ceramic capacitor at the output. The capacitor values should be selected based on the specific application requirements and noise tolerance.
  • To protect the regulator from input voltage transients and surges, it is recommended to add a TVS (Transient Voltage Suppressor) diode or a voltage clamp at the input. Additionally, a series resistor and capacitor can be used to filter out high-frequency noise.
  • To ensure reliable start-up, it is recommended to sequence the power-up of multiple regulators in a system. The regulators should be powered up in a sequence that ensures the output voltage of one regulator is stable before the next regulator is powered up.

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LM20143QMHX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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