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LM25010Q0MH/NOPB - Texas Instruments

Description: Automotive Grade 6-42V Wide Vin, 1A, Constant On-Time Non-Synchronous Buck Regulator

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PCB Footprints
LM25010Q0MH/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PWP0014A _2021
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3D Models
LM25010Q0MH/NOPB - Texas Instruments  - 3D model - Small Outline Packages - PWP0014A _2021
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LM25010Q0MH/NOPB Details

  • Manufacturer Part Number:

    LM25010Q0MH/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    SEATED HGT-NOM, OPERATES IN ADJUSTABLE MODE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Input Voltage-Max:

    42 V

  • Input Voltage-Min:

    6 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Max:

    37 V

  • Output Voltage-Min:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LM25010Q0MH/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout for the LM25010Q0MH/NOPB in the datasheet, which includes a thermal pad connected to a large copper area on the PCB to dissipate heat. Additionally, it's recommended to use a 4-layer PCB with a solid ground plane to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines. This includes using a heat sink, ensuring good airflow, and keeping the device within its recommended operating temperature range. Additionally, consider using thermal interface materials and conformal coatings to improve thermal performance.
  • Operating the LM25010Q0MH/NOPB beyond its recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. This includes exceeding the maximum junction temperature, input voltage, or output current. Always ensure that the device operates within its recommended specifications to guarantee reliable operation.
  • To troubleshoot issues with the LM25010Q0MH/NOPB, start by verifying that the device is properly connected and configured according to the datasheet. Check for proper input voltage, output voltage, and current levels. Use oscilloscopes and thermal imaging cameras to identify any anomalies. Consult the datasheet and application notes for troubleshooting guides and FAQs.
  • The LM25010Q0MH/NOPB is designed to meet EMI and EMC standards, but proper PCB layout, component selection, and shielding are still essential to minimize electromagnetic interference. Follow Texas Instruments' guidelines for EMI and EMC design, and consider using EMI filters, shielding, and grounding techniques to ensure compliance with relevant standards.

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LM25010Q0MH/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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