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LM25010Q1MHX/NOPB - Texas Instruments

Description: Switching Voltage Regulators Automotive Grade 6-42V Wide Vin, 1A, Constant On-Time Non-Synchronous Buck Regulator 14-HTSSOP -40 to 125

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LM25010Q1MHX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PWP0014A
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LM25010Q1MHX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - PWP0014A
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LM25010Q1MHX/NOPB Details

  • Manufacturer Part Number:

    LM25010Q1MHX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    SEATED HGT-NOM, OPERATES IN ADJUSTABLE MODE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Input Voltage-Max:

    42 V

  • Input Voltage-Min:

    6 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Max:

    37 V

  • Output Voltage-Min:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LM25010Q1MHX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the LM25010Q1MHX/NOPB datasheet, which includes a thermal pad connected to a large copper area on the PCB to dissipate heat. Additionally, it's recommended to use a 2-ounce copper layer and to avoid routing high-current traces under the device.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines. This includes providing adequate heat sinking, using a thermally conductive material for the PCB, and ensuring good airflow around the device. Additionally, the device should be operated within its specified temperature range (-40°C to 150°C) and derated accordingly.
  • Exceeding the maximum junction temperature (150°C) can lead to reduced device reliability, increased thermal resistance, and potentially even device failure. Prolonged operation above the maximum junction temperature can cause permanent damage to the device, leading to a decrease in its performance and lifespan.
  • The selection of input and output capacitors depends on the specific requirements of the application, including the input voltage, output voltage, and desired ripple and noise performance. Texas Instruments provides guidelines for capacitor selection in the LM25010Q1MHX/NOPB datasheet, including recommended capacitor values and types.
  • The LM25010Q1MHX/NOPB is designed to meet EMI and EMC requirements, but proper PCB layout and design are still essential to minimize electromagnetic interference. This includes using a solid ground plane, minimizing loop areas, and using shielding and filtering as necessary. Additionally, the device should be operated within its specified frequency range to minimize EMI.

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LM25010Q1MHX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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