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LM25011AQ1MY/NOPB - Texas Instruments

Description: Texas Instruments, LM25011AQ1MY/NOPB Step-Down Switching Regulator 2A Adjustable, 2.51 → 40 V, 10-Pin MSOP

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PCB Footprints
LM25011AQ1MY/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - HVSSOP
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LM25011AQ1MY/NOPB - Texas Instruments  - 3D model - Small Outline Packages - HVSSOP
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LM25011AQ1MY/NOPB Details

  • Manufacturer Part Number:

    LM25011AQ1MY/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ADJUSTABLE OUTPUT VOLTAGE FROM 2.51 V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT/VOLTAGE-MODE

  • Control Technique:

    CONSTANT ON TIME

  • Input Voltage-Max:

    42 V

  • Input Voltage-Min:

    6 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2 A

  • Output Voltage-Max:

    40 V

  • Output Voltage-Min:

    2.51 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.09 mm

  • Supply Current-Max (Isup):

    1.6 mA

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2000 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LM25011AQ1MY/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides some guidelines, but a more detailed application note (SLUA477) provides additional guidance.
  • To ensure reliable start-up and shutdown, it's essential to follow the recommended power sequencing and voltage ramp rates. The datasheet provides guidelines for power-on and power-off sequences, and application notes (such as SLUA478) provide additional guidance.
  • The critical components that affect the stability of the LM25011AQ1MY/NOPB include the input and output capacitors, the inductor, and the feedback resistors. The datasheet provides recommended values and tolerances for these components, and application notes (such as SLUA479) provide additional guidance.
  • To troubleshoot issues with the LM25011AQ1MY/NOPB, start by checking the PCB layout, component values, and soldering quality. Use an oscilloscope to measure the output voltage and current, and check for signs of oscillation or instability. The datasheet and application notes (such as SLUA480) provide additional guidance on troubleshooting and debugging.
  • Thermal design considerations for the LM25011AQ1MY/NOPB include ensuring good airflow around the device, using a heat sink or thermal pad, and avoiding thermal hotspots on the PCB. The datasheet provides thermal resistance values and application notes (such as SLUA481) provide additional guidance.

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LM25011AQ1MY/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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