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LM25011AQ1MYX/NOPB - Texas Instruments

Description: Conv DC-DC 6V to 42V Step Down Single-Out 2.51V to 40V 2A Automotive 10-Pin HVSSOP EP T/R

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LM25011AQ1MYX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGQ0010A
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LM25011AQ1MYX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DGQ0010A
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LM25011AQ1MYX/NOPB Details

  • Manufacturer Part Number:

    LM25011AQ1MYX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ADJUSTABLE OUTPUT VOLTAGE FROM 2.51 V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT/VOLTAGE-MODE

  • Control Technique:

    CONSTANT ON TIME

  • Input Voltage-Max:

    42 V

  • Input Voltage-Min:

    6 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2 A

  • Output Voltage-Max:

    40 V

  • Output Voltage-Min:

    2.51 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.09 mm

  • Supply Current-Max (Isup):

    1.6 mA

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2000 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LM25011AQ1MYX/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides some guidelines, but a more detailed application note from TI provides additional recommendations.
  • To ensure reliable start-up and shutdown, it's essential to follow the recommended power sequencing and voltage ramp rates. The datasheet provides some guidelines, but it's also important to consider the specific application requirements and ensure that the input voltage and current are within the recommended specifications.
  • The critical components that affect the device's EMI performance include the input and output capacitors, the inductor, and the PCB layout. Proper selection and placement of these components can significantly impact the device's EMI performance.
  • To optimize the device's efficiency, it's essential to consider the specific application requirements, such as the input voltage, output voltage, and load current. The datasheet provides some guidelines, but it's also important to consider the device's operating frequency, switching losses, and conduction losses.
  • The recommended testing and validation procedures include environmental testing (e.g., temperature, humidity), electrical testing (e.g., voltage, current), and reliability testing (e.g., accelerated life testing). It's also important to follow the recommended assembly and handling procedures to ensure the device's reliability.

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LM25011AQ1MYX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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