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LM26LVQISDX-135/NOPB - Texas Instruments

Description: Automotive Grade, 1.6V-Capable Temperature Sensor Switch with Factory Programmed Trip Points

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LM26LVQISDX-135/NOPB - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - NGF0006A
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LM26LVQISDX-135/NOPB - Texas Instruments  - 3D model - Small Outline No-lead - NGF0006A
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LM26LVQISDX-135/NOPB Details

  • Manufacturer Part Number:

    LM26LVQISDX-135/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Accuracy-Max (Cel):

    2.3 Cel

  • Additional Feature:

    IT ALSO HAS ACCURACY MINUS 2.3, 2.2 AND 1.7

  • Body Breadth:

    2.2 mm

  • Body Height:

    0.8 mm

  • Body Length or Diameter:

    2.5 mm

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    6

  • Operating Current-Max:

    0.016 mA

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SOLCC6,.1,25

  • Package Shape/Style:

    RECTANGULAR

  • Screening Level:

    AEC-Q100

  • Sensors/Transducers Type:

    TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SINGLE TRIP POINT

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.6 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Termination Type:

    SOLDER

LM26LVQISDX-135/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane and a thermal relief pattern around the device to ensure optimal thermal performance. A detailed layout guide can be found in the application note 'LM26LVQISDX-135/NOPB PCB Layout Guidelines' (SLVAE04).
  • To ensure accurate temperature measurement in high-vibration environments, it is recommended to use a mechanical fixture to secure the device to the PCB, and to add a thermal interface material (TIM) between the device and the heat source. Additionally, the device should be calibrated before use to account for any thermal gradients or mechanical stresses.
  • The recommended calibration procedure involves applying a known temperature to the device and measuring the output voltage. The device should be calibrated in a temperature-controlled environment, and the calibration data should be stored in a non-volatile memory or a lookup table. A detailed calibration procedure can be found in the application note 'LM26LVQISDX-135/NOPB Calibration and Testing' (SLVAE05).
  • To handle EMI when using the LM26LVQISDX-135/NOPB, it is recommended to use a shielded cable or a twisted pair cable to connect the device to the microcontroller or other circuitry. Additionally, the device should be placed in a shielded enclosure or a metal box to reduce electromagnetic radiation. A detailed EMI mitigation guide can be found in the application note 'LM26LVQISDX-135/NOPB EMI Considerations' (SLVAE06).
  • The recommended power-up sequence for the LM26LVQISDX-135/NOPB is to apply the power supply voltage (VCC) before applying the input voltage (VIN). This ensures that the internal voltage regulator is fully powered up before the device starts operating. A detailed power-up sequence can be found in the datasheet or the application note 'LM26LVQISDX-135/NOPB Power-Up and Power-Down Sequencing' (SLVAE07).

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LM26LVQISDX-135/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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