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LM27313XQMF/NOPB - Texas Instruments

Description: 1.6 MHz boost converter with 30V Internal FET switch in SOT-23, AEC-Q100 qualified

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LM27313XQMF/NOPB - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV (R-PDSO-G5)
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LM27313XQMF/NOPB - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV (R-PDSO-G5)
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LM27313XQMF/NOPB Details

  • Manufacturer Part Number:

    LM27313XQMF/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    14 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    28 V

  • Output Voltage-Min:

    4 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SOP5,.11,38

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    1900 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

LM27313XQMF/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. The datasheet provides some guidelines, but a more detailed application note from TI provides additional guidance.
  • To ensure reliable start-up, it's essential to follow proper power sequencing and decoupling guidelines. TI recommends using a soft-start circuit to limit inrush current and ensure a smooth start-up. Additionally, using a high-quality decoupling capacitor and following proper PCB layout practices can help mitigate noise issues.
  • Operating the device at high ambient temperatures can affect its performance and reliability. TI recommends derating the device's output current and voltage ratings at high temperatures to ensure reliable operation. Additionally, ensuring good airflow and using a heat sink can help mitigate thermal issues.
  • To troubleshoot issues with output voltage regulation, start by verifying the input voltage, output voltage, and feedback resistors. Check for any signs of overheating, and ensure that the device is properly decoupled. If issues persist, consult the datasheet and application notes for guidance on troubleshooting and debugging techniques.
  • To minimize EMI and EMC issues, follow proper PCB layout practices, such as separating analog and digital grounds, using a solid ground plane, and minimizing loop areas. Additionally, using a common-mode choke and shielding can help reduce EMI emissions. TI provides additional guidance on EMI and EMC considerations in their application notes.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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