SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.2 mm
Supply Current-Max:
3 mA
Supply Voltage-Max:
95 V
Supply Voltage-Min:
12 V
Supply Voltage-Nom:
48 V
Supply Voltage1-Max:
95 V
Supply Voltage1-Min:
12 V
Supply Voltage1-Nom:
48 V
Surface Mount:
YES
Technology:
BICMOS
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
0.635 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
4.4 mm
LM3464MHX/NOPB Frequently Asked Questions (FAQs)
Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to improve thermal performance. Additionally, placing the device near a thermal pad or heat sink can help to dissipate heat more efficiently.
To ensure reliable start-up and operation with a wide input voltage range, it is recommended to use a soft-start circuit to limit the inrush current and prevent voltage drops. Additionally, using a high-quality input capacitor with low ESR and a sufficient voltage rating can help to filter out noise and voltage transients.
When selecting the output inductor and capacitor values, consider the output voltage, output current, and switching frequency. A higher inductance value can help to reduce ripple current, while a higher capacitance value can help to improve output voltage regulation. However, increasing the inductance and capacitance values can also increase the overall size and cost of the design.
To minimize EMI in your design, use a shielded inductor, keep the switching node (SW) as short as possible, and use a common-mode choke or EMI filter on the input and output lines. Additionally, placing the device and components in a way that minimizes loop areas and using a ground plane can help to reduce EMI radiation.
When operating the device in high-temperature environments, ensure that the device is properly heatsinked and that the ambient temperature is within the recommended operating range. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink, and ensure that the device is not exposed to thermal shocks or gradients.
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LM3464MHX/NOPB Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
