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LM4050BEM3-2.5+T - Analog Devices

Description: Voltage References 50ppm/ C Precision Micropower Shunt Voltage References with Multiple Reverse Breakdown Voltages

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LM4050BEM3-2.5+T - Analog Devices - PCB symbol
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PCB Footprints
LM4050BEM3-2.5+T - Analog Devices PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - U3+1
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3D Models
LM4050BEM3-2.5+T - Analog Devices - 3D model - SOT23 (3-Pin) - U3+1
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LM4050BEM3-2.5+T Details

  • Manufacturer Part Number:

    LM4050BEM3-2.5+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    3-SOT_23-N/A

  • Package Description:

    TSSOP, TO-236

  • Pin Count:

    3

  • Manufacturer Package Code:

    3-SOT_23-N/A

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2002-08-15

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    TWO TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    2.505 V

  • Output Voltage-Min:

    2.495 V

  • Output Voltage-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temp Coef of Voltage-Max:

    50 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    0.2%

  • Width:

    1.3 mm

LM4050BEM3-2.5+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the LM4050BEM3-2.5+T involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce noise and inductance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended capacitor values and types, and keep the input and output capacitors close to the device. Also, ensure that the PCB layout is well-designed, with minimal noise and inductance. Additionally, consider adding a small series resistor (e.g., 10 ohms) between the output and the load to improve stability.
  • The maximum power dissipation of the LM4050BEM3-2.5+T is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this value can be derated at higher temperatures. Consult the datasheet for more information.
  • The LM4050BEM3-2.5+T is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. Consult the datasheet for temperature-related specifications and consider using a heat sink or thermal management techniques to ensure reliable operation.
  • To protect the LM4050BEM3-2.5+T from input voltage transients and surges, consider adding a TVS (transient voltage suppressor) diode or a voltage clamp circuit at the input. Additionally, ensure that the input capacitor is rated for the maximum expected input voltage and has a sufficient voltage rating.

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LM4050BEM3-2.5+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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