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LM5000-3MTC/NOPB - Texas Instruments

Description: 3.1-40V Wide Vin, 2A Current Mode Non-Synchronous Boost Regulator

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LM5000-3MTC/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - LM5000-3MTC/NOPB-1
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LM5000-3MTC/NOPB Details

  • Manufacturer Part Number:

    LM5000-3MTC/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    3.1 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2.7 A

  • Output Voltage-Max:

    75 V

  • Output Voltage-Min:

    1.259 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    1300 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LM5000-3MTC/NOPB Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Use a soft-start circuit to limit the inrush current during start-up, and ensure a controlled shutdown sequence to prevent voltage spikes and oscillations.
  • The input filter, output filter, and PCB layout are critical components that affect EMI performance. Ensure proper component selection and layout to minimize EMI emissions.
  • Use a low-dropout linear regulator or a low-power switching regulator to minimize power consumption. Optimize the device's operating frequency and voltage settings for low-power operation.
  • Ensure good thermal contact between the device and heat sink, use thermal interface materials, and design for adequate airflow to dissipate heat efficiently.

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LM5000-3MTC/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image LM5000-3MTC Texas Instruments

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