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LM5000SD-3/NOPB - Texas Instruments

Description: 3.1-40V Wide Vin, 2A Current Mode Non-Synchronous Boost Regulator

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PCB Footprints
LM5000SD-3/NOPB - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - NHQ0016A
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3D Models
LM5000SD-3/NOPB - Texas Instruments  - 3D model - Small Outline No-lead - NHQ0016A
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LM5000SD-3/NOPB Details

  • Manufacturer Part Number:

    LM5000SD-3/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    LCC

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    3.1 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-PDSO-N16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2.7 A

  • Output Voltage-Max:

    75 V

  • Output Voltage-Min:

    1.259 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC16,.2,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    1300 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

LM5000SD-3/NOPB Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the input voltage rises and falls monotonically, and that the enable pin is properly biased during start-up and shutdown. A soft-start circuit can also be used to reduce inrush current.
  • The input and output capacitors, inductor, and PCB layout are critical components that affect EMI performance. Proper selection and placement of these components can minimize EMI emissions.
  • Optimize the device's efficiency by selecting the optimal input voltage, output voltage, and switching frequency for your application. Additionally, ensure that the device is operated within its recommended operating conditions.
  • Key considerations for thermal design and heat sinking include selecting a suitable heat sink, ensuring good thermal contact between the device and heat sink, and providing adequate airflow to dissipate heat.

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LM5000SD-3/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image LM5000SD-3 National Semiconductor Corporation

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