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LM53601NQDSXTQ1 - Texas Instruments

Description: 3.5V to 36V, 1A Synchronous 2.1MHz Step-Down Converter for Automotive Applications

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PCB Footprints
LM53601NQDSXTQ1 - Texas Instruments PCB footprint - Other - Other - DSX0010A
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3D Models
LM53601NQDSXTQ1 - Texas Instruments  - 3D model - Other - DSX0010A
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LM53601NQDSXTQ1 Details

  • Manufacturer Part Number:

    LM53601NQDSXTQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES IN PFM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    42 V

  • Input Voltage-Min:

    3.5 V

  • Input Voltage-Nom:

    13.5 V

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Max:

    6 V

  • Output Voltage-Min:

    3.2 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2400 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LM53601NQDSXTQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 4-layer PCB with a solid ground plane and a thermal relief pattern can also help to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, and to ensure that the device is operated within its recommended operating temperature range. Additionally, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • To ensure EMI and EMC compliance, it's essential to follow proper PCB layout and design guidelines, use shielding and filtering components, and ensure that the device is operated within its recommended frequency range. Additionally, consider using EMI filters and shielding components to reduce electromagnetic interference.
  • To troubleshoot common issues such as output voltage deviations or oscillations, start by checking the input voltage, output load, and PCB layout for any anomalies. Verify that the device is operated within its recommended operating conditions, and check for any signs of overheating or electrical overstress. Use oscilloscopes and other diagnostic tools to identify the root cause of the issue.
  • The recommended test and measurement procedures for the LM53601NQDSXTQ1 involve using a combination of oscilloscopes, multimeters, and other diagnostic tools to measure key parameters such as output voltage, current, and frequency. Follow the recommended test procedures outlined in the datasheet and application notes to ensure accurate and reliable measurements.

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LM53601NQDSXTQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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