ALSO OPTS IN PFM CONTROL TECH, ALSO AVLB VOUT = 5V, ALSO OPTS IN ADJ MODE FROM 3.3 TO 6V
Analog IC - Other Type:
SWITCHING REGULATOR
Control Mode:
CURRENT-MODE
Control Technique:
PULSE WIDTH MODULATION
Input Voltage-Max:
42 V
Input Voltage-Min:
3.5 V
Input Voltage-Nom:
13.5 V
JESD-30 Code:
R-PDSO-G16
JESD-609 Code:
e4
Length:
5 mm
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Outputs:
1
Number of Terminals:
16
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-40 °C
Output Current-Max:
2 A
Output Voltage-Max:
9.9 V
Output Voltage-Min:
3.2 V
Output Voltage-Nom:
3.3 V
Package Body Material:
PLASTIC/EPOXY
Package Code:
HSOP
Package Equivalence Code:
TSSOP16,.25
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, HEAT SINK/SLUG
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Screening Level:
AEC-Q100
Seated Height-Max:
1 mm
Surface Mount:
YES
Switcher Configuration:
BUCK
Switching Frequency-Max:
2350 kHz
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
4.4 mm
LM53602AQPWPRQ1 Frequently Asked Questions (FAQs)
A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 4-layer PCB with a solid ground plane and a thermal relief pattern can also help to dissipate heat efficiently.
To ensure reliable operation over the full temperature range, it is essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure that the device is properly soldered and connected. Additionally, the device should be operated within its recommended operating conditions, and the input voltage should be regulated to prevent overvoltage or undervoltage conditions.
The critical components that affect the output voltage ripple of the LM53602AQPWPRQ1 include the output capacitor (COUT), the inductor (L), and the input capacitor (CIN). The selection of these components can significantly impact the output voltage ripple, and it is essential to choose components that meet the recommended specifications.
To optimize the design for low EMI, it is essential to follow proper PCB design and layout guidelines, use a shielded inductor, and ensure that the device is properly decoupled from the input and output capacitors. Additionally, the use of a common-mode choke and a shielded cable can help to reduce EMI emissions.
When selecting the input and output capacitors, key considerations include the capacitor's equivalent series resistance (ESR), capacitance value, and voltage rating. The capacitor should be able to handle the maximum input voltage and output current, and its ESR should be low enough to minimize voltage ripple and ensure stable operation.
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LM53602AQPWPRQ1 Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
