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LM63625DQPWPRQ1 - Texas Instruments

Description: Switching Voltage Regulators 3.5-V to 36-V, 2.5-A step-down voltage converter with spread spectrum 16-HTSSOP -40 to 125

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LM63625DQPWPRQ1 - Texas Instruments PCB footprint - Other - Other - LM63625DQPWPRQ1-2
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LM63625DQPWPRQ1 - Texas Instruments  - 3D model - Other - LM63625DQPWPRQ1-2
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LM63625DQPWPRQ1 Details

  • Manufacturer Part Number:

    LM63625DQPWPRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2019-10-09

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO HAS CONTROL TECHNIQUE OF PFM; ALSO HAS 5V O/P VOL-NOM

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    3.5 V

  • Input Voltage-Nom:

    13.5 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2.5 A

  • Output Voltage-Max:

    20 V

  • Output Voltage-Min:

    1 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max (Isup):

    0.023 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2200 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LM63625DQPWPRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides some guidelines, but a more detailed application note (SLUA623) provides additional recommendations.
  • The choice of input and output capacitors depends on the specific requirements of your application, such as the input voltage range, output voltage, and desired ripple and noise performance. TI provides a capacitor selection guide (SLUA623) that can help with this process.
  • Operating the device at high ambient temperatures can affect its performance and reliability. The datasheet provides thermal derating information, but it's essential to consider the specific thermal requirements of your application and ensure that the device is properly cooled.
  • To ensure EMC in your design, follow proper PCB layout and grounding techniques, use shielding and filtering as needed, and consider the device's electromagnetic emissions and susceptibility. TI provides an application note (SLAA554) on EMC design considerations for switch-mode power supplies.
  • The trade-offs between efficiency, output voltage ripple, and component selection depend on the specific requirements of your application. In general, increasing the switching frequency can improve efficiency but may increase output voltage ripple, while using larger inductors and capacitors can reduce ripple but may decrease efficiency.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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