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LM7301SN1T1G - onsemi

Description: Standard (General Purpose) Amplifier 1 Circuit Rail-to-Rail 5-TSOP -40°C ~ 85°C,10.5 mA,32V

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PCB Footprints
LM7301SN1T1G - onsemi PCB footprint - Other - Other - TSOP−5 3.00x1.50x0.95, 0.95P CASE 483 ISSUE P_2025
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3D Models
LM7301SN1T1G - onsemi  - 3D model - Other - TSOP−5 3.00x1.50x0.95, 0.95P CASE 483 ISSUE P_2025
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LM7301SN1T1G Details

  • Manufacturer Part Number:

    LM7301SN1T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.17

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.25 µA

  • Bias Current-Max (IIB) @25C:

    0.3 µA

  • Common-mode Reject Ratio-Nom:

    82 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    8000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1.25 V/us

  • Supply Current-Max:

    1.35 mA

  • Supply Voltage Limit-Max:

    35 V

  • Supply Voltage-Nom (Vsup):

    2.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    4000

  • Voltage Gain-Min:

    5010

  • Wideband:

    NO

  • Width:

    1.5 mm

LM7301SN1T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for the LM7301SN1T1G should include a solid ground plane, wide power traces, and a thermal relief pattern under the IC. This helps to reduce thermal resistance and improve heat dissipation.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, a minimum ESR (Equivalent Series Resistance) of 0.1 ohms for the output capacitor is recommended to prevent oscillations.
  • The maximum allowed input voltage ripple for the LM7301SN1T1G is 10% of the nominal input voltage. Exceeding this limit may affect the regulator's performance and stability.
  • While ceramic capacitors can be used, they may not be the best choice due to their high ESR. A low-ESR electrolytic capacitor or a polymer capacitor is recommended for the output capacitor (Cout) to ensure stability and optimal performance.
  • The power dissipation can be calculated using the formula: Pd = (Vin - Vout) x Iout. The junction temperature can be estimated using the thermal resistance (RθJA) and the power dissipation. A thermal analysis or simulation tool can also be used to estimate the junction temperature.

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LM7301SN1T1G Overview

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