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LM7322MMX/NOPB - Texas Instruments

Description: OP Amp Dual GP R-R I/O ±16V/32V 8-Pin VSSOP T/R

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LM7322MMX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK
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LM7322MMX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DGK
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LM7322MMX/NOPB Details

  • Manufacturer Part Number:

    LM7322MMX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, VSSOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    1.5 µA

  • Bias Current-Max (IIB) @25C:

    1 µA

  • Common-mode Reject Ratio-Min:

    62 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    6000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -17.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    12.3 V/us

  • Supply Current-Max:

    5.6 mA

  • Supply Voltage Limit-Max:

    17.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    16000

  • Voltage Gain-Min:

    560

  • Wideband:

    NO

  • Width:

    3 mm

LM7322MMX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to minimize thermal resistance. A thermal pad on the bottom of the package should be connected to the ground plane.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, a minimum output capacitance of 10uF with an ESR of 1 ohm or less is recommended. The output voltage should also be decoupled from the input voltage with a 1uF capacitor.
  • The absolute maximum input voltage rating for the LM7322MMX/NOPB is 18V. However, it's recommended to operate the device within the specified input voltage range of 5.5V to 15V to ensure reliable operation and prevent damage.
  • The LM7322MMX/NOPB is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It's essential to follow the recommended thermal design and derating guidelines to ensure reliable operation in high-temperature environments.
  • To troubleshoot issues with the output voltage regulation, check the input voltage, output voltage, and output current. Verify that the input voltage is within the specified range and that the output voltage is within the desired range. Check for any signs of overheating, and ensure that the device is properly soldered and mounted on the PCB.

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LM7322MMX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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