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LM8262MMX/NOPB - Texas Instruments

Description: RRIO, High Output Current & Unlimited Cap Load Op Amp in MSOP

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LM8262MMX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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LM8262MMX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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LM8262MMX/NOPB Details

  • Manufacturer Part Number:

    LM8262MMX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    2.8 µA

  • Bias Current-Max (IIB) @25C:

    2 µA

  • Common-mode Reject Ratio-Min:

    84 dB

  • Common-mode Reject Ratio-Nom:

    110 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.275 µA

  • Input Offset Voltage-Max:

    7000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -12 V

  • Neg Supply Voltage-Nom (Vsup):

    -11 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    7 V/us

  • Slew Rate-Nom:

    12 V/us

  • Supply Current-Max:

    2.5 mA

  • Supply Voltage Limit-Max:

    12 V

  • Supply Voltage-Nom (Vsup):

    11 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    21000

  • Voltage Gain-Min:

    1400

  • Wideband:

    NO

  • Width:

    3 mm

LM8262MMX/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LM8262MMX/NOPB involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the input and output capacitors are of high quality and have low ESR. It's also important to decouple the input and output with ceramic capacitors.
  • The LM8262MMX/NOPB has an operating ambient temperature range of -40°C to 125°C. However, the device can be operated at a higher temperature range with derating.
  • Yes, the LM8262MMX/NOPB is suitable for high-reliability applications. It's manufactured using a high-reliability process and has undergone rigorous testing to ensure its performance and reliability.
  • To troubleshoot issues with the LM8262MMX/NOPB, start by checking the input and output voltages, as well as the current consumption. Verify that the device is properly soldered and that the PCB layout is correct. Use an oscilloscope to check for oscillations or other anomalies.

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LM8262MMX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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