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LM8330TME/NOPB - Texas Instruments

Description: I2C-Compatible Keypad Controller with GPIO, PWM, and IEC61000 ESD Protection

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PCB Footprints
LM8330TME/NOPB - Texas Instruments PCB footprint - BGA - BGA - YFQ0025_4
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3D Models
LM8330TME/NOPB - Texas Instruments  - 3D model - BGA - YFQ0025_4
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LM8330TME/NOPB Details

  • Manufacturer Part Number:

    LM8330TME/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    25

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Address Bus Width:

    128

  • JESD-30 Code:

    S-PBGA-B25

  • JESD-609 Code:

    e1

  • Length:

    2.01 mm

  • Moisture Sensitivity Level:

    1

  • Number of I/O Lines:

    20

  • Number of Ports:

    20

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA25,5X5,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.675 mm

  • Supply Current-Max:

    0.03 mA

  • Supply Voltage-Max:

    1.98 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.01 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR CIRCUIT

LM8330TME/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LM8330 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the output is properly terminated, and the input is properly biased. Additionally, adding a small capacitor (e.g., 10nF) between the output and ground can help improve stability.
  • The maximum power dissipation of the LM8330 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this can be derated to 0.8W at 50°C ambient temperature.
  • Yes, the LM8330 can be used as a unity gain buffer. However, it's essential to ensure that the input is properly biased, and the output is properly terminated. Additionally, the gain bandwidth product of the device should be considered to ensure that it can handle the desired frequency range.
  • To protect the LM8330 from overvoltage and ESD, it's recommended to add external protection devices such as TVS diodes or zener diodes. Additionally, following proper PCB design and layout guidelines, such as keeping sensitive nodes away from the edge of the board, can help reduce the risk of ESD damage.

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LM8330TME/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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