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LM9061M/NOPB - Texas Instruments

Description: Texas Instruments LM9061M/NOPB, MOSFET Power Driver,, 7 → 26 V, Non-Inverting, 8-Pin SOIC

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LM9061M/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G8)
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3D Models
LM9061M/NOPB - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G8)
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LM9061M/NOPB Details

  • Manufacturer Part Number:

    LM9061M/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    0.01 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    40 mA

  • Supply Voltage-Max:

    26 V

  • Supply Voltage-Min:

    7 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Technology:

    BIMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    10000 µs

  • Turn-on Time:

    1500 µs

  • Width:

    3.9 mm

LM9061M/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LM9061M/NOPB involves placing the device near a thermal pad or a heat sink, using a solid ground plane, and minimizing the distance between the device and the thermal pad or heat sink. Additionally, using a thermal via array under the device can help to dissipate heat more efficiently.
  • The input capacitor should be chosen based on the input voltage ripple requirement, output voltage, and the desired level of noise filtering. A general rule of thumb is to use a capacitor with a value between 1uF to 10uF, with a voltage rating that exceeds the maximum input voltage. X5R or X7R ceramic capacitors are good options due to their low ESR and high reliability.
  • The LM9061M/NOPB can operate in ambient temperatures up to 125°C, but the device's junction temperature should not exceed 150°C. It's essential to ensure proper thermal design and heat sinking to maintain a safe operating temperature.
  • Yes, the LM9061M/NOPB is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard for automotive applications and is manufactured using a high-reliability process. However, it's essential to consult with Texas Instruments' application engineers to ensure the device meets the specific requirements of your application.
  • To troubleshoot issues with the LM9061M/NOPB, start by verifying the input voltage, output voltage, and current consumption. Check for proper PCB layout, thermal design, and component selection. Use an oscilloscope to monitor the output voltage and current waveforms. Consult the datasheet and application notes for guidance on troubleshooting and debugging techniques.

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LM9061M/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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