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LMC6041IN - Texas Instruments

Description: Standard Amplifier 1 Circuit Rail-to-Rail 8-PDIP

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LMC6041IN - Texas Instruments PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - P (R-PDIP-T8)
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LMC6041IN - Texas Instruments  - 3D model - Dual-In-Line Packages - P (R-PDIP-T8)
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LMC6041IN Details

  • Manufacturer Part Number:

    LMC6041IN

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    PLASTIC, DIP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000004 µA

  • Common-mode Reject Ratio-Min:

    62 dB

  • Common-mode Reject Ratio-Nom:

    75 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    6000 µV

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.8171 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    RAIL

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Slew Rate-Min:

    0.007 V/us

  • Slew Rate-Nom:

    0.02 V/us

  • Supply Current-Max:

    0.039 mA

  • Supply Voltage Limit-Max:

    16 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    75

  • Voltage Gain-Min:

    40000

  • Wideband:

    NO

  • Width:

    7.62 mm

LMC6041IN Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LMC6041IN is dependent on the package type and ambient temperature. For the SOIC package, the maximum power dissipation is 670mW at 25°C. For the PDIP package, it is 830mW at 25°C. However, it is recommended to derate the power dissipation based on the ambient temperature to ensure reliable operation.
  • To ensure stability in a unity-gain configuration, it is recommended to add a capacitor (typically 10-22pF) between the output and the inverting input pins. This capacitor helps to compensate for the internal pole of the op-amp and prevents oscillations.
  • To minimize noise and EMI, it is recommended to follow good PCB layout practices such as keeping the signal traces short and away from noise sources, using a solid ground plane, and decoupling the power supply pins with capacitors. Additionally, it is recommended to place the input and output pins on opposite sides of the package to minimize capacitive coupling.
  • While the LMC6041IN can be used as a comparator, it is not recommended due to its relatively slow slew rate (0.5V/μs) and limited output current (±20mA). Texas Instruments recommends using a dedicated comparator such as the LM339 or LM2901 for comparator applications.
  • The input bias current of the LMC6041IN is typically around 10pA, which is relatively low. However, it can still cause errors in high-impedance circuits. To handle the input bias current, it is recommended to use a high-impedance input source, add a bias current compensation resistor, or use a chopper-stabilized op-amp such as the LMC6042.

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LMC6041IN Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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