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LMC6082IM - Texas Instruments

Description: OpAmpIC

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LMC6082IM - Texas Instruments PCB footprint - Other - Other - SOIC127P600X175-8N
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LMC6082IM - Texas Instruments  - 3D model - Other - SOIC127P600X175-8N
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LMC6082IM Details

  • Manufacturer Part Number:

    LMC6082IM

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    1995-01-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000004 µA

  • Bias Current-Max (IIB) @25C:

    1e-7 µA

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.000002 µA

  • Input Offset Voltage-Max:

    350 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e0

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    235

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.6 V/us

  • Slew Rate-Nom:

    1.5 V/us

  • Supply Current-Max:

    1.5 mA

  • Supply Voltage Limit-Max:

    16 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Unity Gain BW-Nom:

    1300

  • Voltage Gain-Min:

    35000

  • Wideband:

    NO

  • Width:

    3.9 mm

LMC6082IM Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane, and placing the LMC6082IM close to the analog signal sources to minimize noise. Additionally, it's recommended to keep the analog and digital grounds separate and connect them at a single point.
  • Optimizing performance requires careful consideration of the input signal, output load, and power supply. Ensure the input signal is within the recommended range, and the output load is within the specified current limits. Also, use a low-noise power supply and decouple the power pins with capacitors.
  • The LMC6082IM is rated for operation from -40°C to 125°C. However, the device's performance may degrade at extreme temperatures, and it's recommended to operate within the specified temperature range for optimal performance.
  • The LMC6082IM has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure the PCB is properly grounded.
  • The recommended power-up sequence is to apply the power supply voltage (VCC) before applying the input signal. This ensures the internal biasing and reference circuits are properly established before the input signal is applied.

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LMC6082IM Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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