LMC6462BIM - Texas Instruments

LMC6462BIM Details

• Manufacturer Part Number:

  LMC6462BIM

• Pbfree Code:

  No

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  SOIC

• Package Description:

  PLASTIC, MS-012AA, SOIC-8

• Pin Count:

  8

• ECCN Code:

  EAR99

• HTS Code:

  8542.33.00.01

• Manufacturer:

  Texas Instruments

• YTEOL:

  0

• Amplifier Type:

  OPERATIONAL AMPLIFIER

• Architecture:

  VOLTAGE-FEEDBACK

• Average Bias Current-Max (IIB):

  0.00001 µA

• Bias Current-Max (IIB) @25C:

  0.00001 µA

• Common-mode Reject Ratio-Min:

  62 dB

• Common-mode Reject Ratio-Nom:

  85 dB

• Frequency Compensation:

  YES

• Input Offset Voltage-Max:

  3700 µV

• JESD-30 Code:

  R-PDSO-G8

• JESD-609 Code:

  e0

• Length:

  4.9 mm

• Low-Bias:

  YES

• Low-Offset:

  NO

• Micropower:

  YES

• Moisture Sensitivity Level:

  1

• Number of Functions:

  2

• Number of Terminals:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  SOP

• Package Equivalence Code:

  SOP8,.25

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE

• Packing Method:

  RAIL

• Peak Reflow Temperature (Cel):

  235

• Power:

  NO

• Programmable Power:

  NO

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.75 mm

• Slew Rate-Min:

  0.008 V/us

• Slew Rate-Nom:

  0.028 V/us

• Supply Current-Max:

  0.07 mA

• Supply Voltage Limit-Max:

  16 V

• Supply Voltage-Nom (Vsup):

  5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  TIN LEAD

• Terminal Form:

  GULL WING

• Terminal Pitch:

  1.27 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  20

• Unity Gain BW-Nom:

  50

• Wideband:

  NO

• Width:

  3.9 mm