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LMC6482IMM/NOPB - Texas Instruments

Description: Ultra-low Bias Current, Precision CMOS Rail-to-Rail Input and Output Dual Operational Amplifier

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LMC6482IMM/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK
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LMC6482IMM/NOPB Details

  • Manufacturer Part Number:

    LMC6482IMM/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000004 µA

  • Bias Current-Max (IIB) @25C:

    0.000004 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    82 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.000002 µA

  • Input Offset Voltage-Max:

    750 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    0.63 V/us

  • Slew Rate-Nom:

    1.3 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    1.4 mA

  • Supply Voltage Limit-Max:

    16 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1500

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3 mm

LMC6482IMM/NOPB Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LMC6482IMM/NOPB is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability in a unity-gain buffer configuration, it's recommended to add a capacitor (typically 10-100pF) between the output and the inverting input to prevent oscillations. Additionally, ensure that the layout is well-designed to minimize parasitic inductance and capacitance.
  • The recommended operating voltage range for the LMC6482IMM/NOPB is 4.5V to 15.5V, although the device can operate down to 3V with reduced performance. It's essential to ensure the voltage supply is within the recommended range to maintain optimal performance and prevent damage to the device.
  • To prevent electrostatic discharge (ESD) damage, it's essential to handle the LMC6482IMM/NOPB with proper ESD protection measures, such as using an ESD wrist strap, anti-static bags, and mats. Additionally, ensure that the PCB design includes ESD protection components, such as TVS diodes or ESD protection arrays.
  • The maximum input voltage range for the LMC6482IMM/NOPB is from -0.5V to VCC + 0.5V. Exceeding this range can cause damage to the device or affect its performance.

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LMC6482IMM/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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