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LMC6572BIM/NOPB - Texas Instruments

Description: Dual Low Voltage (2.7V to 3V) Operational Amplifier

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LMC6572BIM/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G8)
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LMC6572BIM/NOPB - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G8)
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LMC6572BIM/NOPB Details

  • Manufacturer Part Number:

    LMC6572BIM/NOPB

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SO-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    57 dB

  • Common-mode Reject Ratio-Nom:

    75 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    7500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    RAIL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    10 V/us

  • Slew Rate-Nom:

    0.09 V/us

  • Supply Current-Max:

    0.14 mA

  • Supply Voltage Limit-Max:

    12 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    220

  • Wideband:

    NO

  • Width:

    3.9 mm

LMC6572BIM/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-frequency PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using bypass capacitors to reduce noise and oscillations.
  • Monitor the device's power supply voltage, input common-mode voltage, and output current to ensure they are within the recommended operating conditions specified in the datasheet. Additionally, ensure the device is operated within its recommended temperature range.
  • The maximum capacitive load that the LMC6572BIM/NOPB can drive is not explicitly stated in the datasheet, but it's recommended to follow the general guideline of keeping the capacitive load below 100pF to ensure stability and prevent oscillations.
  • Check the PCB layout for any potential issues, such as poor grounding or inadequate decoupling. Verify that the device is operated within its recommended operating conditions and that the input and output signals are within the specified ranges. Use an oscilloscope to observe the output signal and look for any signs of oscillation or instability.
  • The LMC6572BIM/NOPB is rated for operation up to 125°C, but it's recommended to derate the device's performance and ensure proper thermal management to prevent overheating and reduce the risk of failure.

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LMC6572BIM/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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