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LMC662CMX - Texas Instruments

Description: Operational Amplifiers - Op Amps Dual 15.5V, 1.4MHz, improved offset, CMOS operational amplifier 8-SOIC 0 to 70

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LMC662CMX - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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LMC662CMX Details

  • Manufacturer Part Number:

    LMC662CMX

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    1995-01-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000002 µA

  • Bias Current-Max (IIB) @25C:

    0.000004 µA

  • Common-mode Reject Ratio-Min:

    63 dB

  • Common-mode Reject Ratio-Nom:

    83 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.000001 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e0

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    235

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.7 V/us

  • Slew Rate-Nom:

    1.1 V/us

  • Supply Current-Max:

    1.3 mA

  • Supply Voltage Limit-Max:

    16 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    1400

  • Voltage Gain-Min:

    40000

  • Wideband:

    NO

  • Width:

    3.9 mm

LMC662CMX Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LMC662CMX is dependent on the package type and thermal resistance. For the SOIC package, the maximum power dissipation is approximately 670mW at 25°C. However, it's recommended to check the thermal resistance and power dissipation calculations in the datasheet to ensure safe operation.
  • To ensure stability in a unity-gain configuration, it's recommended to add a capacitor (typically 10-100pF) between the output and the inverting input pins. This helps to compensate for the internal pole and ensures stability. Additionally, make sure to follow proper PCB layout and decoupling practices to minimize noise and oscillations.
  • The recommended input common-mode voltage range for the LMC662CMX is between VCC-1.5V and VCC+0.5V. Operating outside this range may result in reduced performance, increased distortion, or even device damage.
  • While the LMC662CMX can be used as a comparator, it's not recommended due to its op-amp architecture and limited output current capability. Texas Instruments recommends using a dedicated comparator device, such as the LM339 or LM2901, for comparator applications.
  • The LMC662CMX has internal ESD protection diodes, but it's still recommended to follow proper ESD handling practices during device handling and PCB assembly. Use an ESD wrist strap, mat, or workstation, and ensure that the device is stored in an anti-static package or bag when not in use.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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