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LME49870MAX/NOPB - Texas Instruments

Description: IC OPAMP AUDIO 55MHZ 8SOIC

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LME49870MAX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G8)
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LME49870MAX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G8)
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LME49870MAX/NOPB Details

  • Manufacturer Part Number:

    LME49870MAX/NOPB

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, SOIC-8PIN

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.072 µA

  • Bias Current-Max (IIB) @25C:

    0.072 µA

  • Common-mode Reject Ratio-Nom:

    120 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    700 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -23 V

  • Neg Supply Voltage-Nom (Vsup):

    -18 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    YES

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    15 V/us

  • Slew Rate-Nom:

    20 V/us

  • Supply Current-Max:

    6.5 mA

  • Supply Voltage Limit-Max:

    23 V

  • Supply Voltage-Nom (Vsup):

    18 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    55000

  • Voltage Gain-Min:

    1778000

  • Wideband:

    NO

  • Width:

    3.91 mm

LME49870MAX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-frequency PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using bypass capacitors to reduce noise and oscillations.
  • To ensure stability, follow the recommended compensation network values and layout, and ensure that the output stage is properly bypassed. Additionally, consider using a stability analysis tool, such as TI's SPICE models, to simulate and optimize your design.
  • The maximum power dissipation of the LME49870MAX/NOPB is dependent on the operating conditions, such as supply voltage, output current, and ambient temperature. Use the thermal resistance values provided in the datasheet to calculate the maximum power dissipation, and ensure that the device is properly heat-sinked to prevent overheating.
  • The LME49870MAX/NOPB is rated for operation up to 150°C, but the device's performance and reliability may be affected at high temperatures. Ensure that the device is properly heat-sinked and that the operating conditions are within the recommended specifications.
  • The output filter components should be selected based on the desired output impedance, frequency response, and noise requirements. Use the datasheet's recommended output filter values as a starting point, and consider using TI's FilterPro software to simulate and optimize your output filter design.

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LME49870MAX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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