TPHL AND TPLH CONSIDERED FOR INDEPENDENT INPUT MODE
Built-in Protections:
THERMAL; UNDER VOLTAGE
Interface IC Type:
HALF BRIDGE BASED PERIPHERAL DRIVER
JESD-30 Code:
R-PBCC-B19
JESD-609 Code:
e3
Length:
4 mm
Moisture Sensitivity Level:
2
Number of Channels:
2
Number of Functions:
1
Number of Terminals:
19
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Output Current Flow Direction:
SOURCE AND SINK
Output Current-Max:
3 A
Output Peak Current Limit-Nom:
0.11 A
Package Body Material:
PLASTIC/EPOXY
Package Code:
HVBCC
Package Shape:
RECTANGULAR
Package Style:
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
0.8 mm
Supply Voltage-Max:
6 V
Supply Voltage-Min:
6 V
Supply Voltage-Nom:
5 V
Surface Mount:
YES
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
BUTT
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
30
Turn-off Time:
0.018 µs
Turn-on Time:
0.018 µs
Width:
3 mm
LMG1210RVRR Frequently Asked Questions (FAQs)
A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-frequency components (e.g., the switching FETs and the output filter) close to the IC, and use short, wide traces to minimize inductance and radiation.
Use the TI WEBENCH Power Designer tool to generate a customized compensation network design based on your specific application requirements. You can also use the datasheet's compensation network design guidelines and adjust the component values based on your specific application's requirements.
The maximum allowed input voltage ripple is 10% of the input voltage. To filter it out, use a low-ESR input capacitor (e.g., ceramic or film capacitor) with a value of at least 10uF, and consider adding a small inductor (e.g., 1uH) in series with the input capacitor to further reduce the ripple.
Use a thermal pad or a heat sink with a thermal conductivity of at least 1W/m-K to dissipate heat. Ensure good airflow around the IC, and consider using a thermal interface material (e.g., thermal tape or thermal grease) to improve heat transfer. Monitor the IC's temperature using the internal thermal monitoring feature or an external temperature sensor.
Choose an inductor with a high saturation current rating and a low DCR (e.g., 1uH, 1.5A, 0.1Ohm). Select a capacitor with a high ripple current rating and a low ESR (e.g., 10uF, 2A, 0.01Ohm). Ensure the filter components are rated for the output voltage and current, and consider using a shielded inductor to reduce EMI.
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LMG1210RVRR Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
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