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LMG3422R030RQZT - Texas Instruments

Description: 600V 30mΩ 1.2A GaN FET With Integrated Driver, Protection, and Temperature Reporting 54-VQFN (12x12).

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LMG3422R030RQZT - Texas Instruments PCB footprint - Other - Other - LMG3422R030RQZT-2
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LMG3422R030RQZT - Texas Instruments  - 3D model - Other - LMG3422R030RQZT-2
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LMG3422R030RQZT Details

  • Manufacturer Part Number:

    LMG3422R030RQZT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Configuration:

    COMPLEX

  • DS Breakdown Voltage-Min:

    600 V

  • Drain-source On Resistance-Max:

    0.035 Ω

  • FET Technology:

    JUNCTION

  • JESD-30 Code:

    S-PQCC-N54

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    1

  • Number of Terminals:

    54

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    GALLIUM NITRIDE

  • Turn-off Time-Max (toff):

    86 ns

  • Turn-on Time-Max (ton):

    56 ns

LMG3422R030RQZT Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LMG3422R030RQZT is -40°C to 150°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of -20°C to 125°C for optimal performance and reliability.
  • To ensure proper biasing, follow the recommended biasing scheme outlined in the datasheet, which includes connecting the VCC pin to a 12V to 15V power supply, and the VEE pin to a -5V to -12V power supply. Additionally, ensure that the input and output pins are properly terminated and matched to the recommended impedance.
  • For optimal thermal management, it's recommended to use a multi-layer PCB with a solid ground plane and to place the device on a thermal pad. Ensure that the PCB layout is designed to minimize thermal resistance and to provide adequate heat dissipation. Additionally, consider using thermal vias and heat sinks to further improve thermal performance.
  • To troubleshoot common issues, start by verifying that the device is properly biased and that the input and output pins are properly terminated. Check for any signs of overheating, and ensure that the PCB layout is designed to minimize thermal resistance. If oscillation or instability persists, try adjusting the input and output impedance matching, or adding additional decoupling capacitors to the power supply lines.
  • To prevent ESD damage, handle the device by the body or pins, and avoid touching the die or internal components. Use an ESD wrist strap or mat, and ensure that the workspace is ESD-protected. When handling the device, use anti-static packaging and follow proper storage and shipping procedures.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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