SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.2 mm
Supply Voltage-Max (Vsup):
3.465 V
Supply Voltage-Min (Vsup):
3.135 V
Surface Mount:
YES
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
4.4 mm
LMH0346MHX/NOPB Frequently Asked Questions (FAQs)
A good PCB layout for the LMH0346MHX involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a low-ESR capacitor for the power supply decoupling.
To ensure proper powering and decoupling, use a low-ESR capacitor (e.g., 10uF) between the power supply pins (VCC and GND) and place it as close as possible to the device. Additionally, use a 0.1uF capacitor between the analog and digital power supply pins (AVCC and DVCC) for further decoupling.
The LMH0346MHX supports clock frequencies up to 148.5 MHz, but the maximum frequency may vary depending on the specific application and system requirements.
To configure the LMH0346MHX for HDMI 2.0 compliance, set the device to TMDS mode, use a 100 MHz clock, and ensure the device is powered from a 1.2V supply. Additionally, follow the HDMI 2.0 specification guidelines for transmitter and receiver configuration.
To manage thermal issues, ensure good airflow around the device, use a heat sink if necessary, and follow the recommended PCB layout guidelines. Additionally, consider using thermal interface materials to improve heat transfer between the device and the heat sink.
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LMH0346MHX/NOPB Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
