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LMH6321MR/NOPB - Texas Instruments

Description: 300 mA High Speed Buffer with Adjustable Current Limit

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LMH6321MR/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DDA0008B
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LMH6321MR/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DDA0008B
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LMH6321MR/NOPB Details

  • Manufacturer Part Number:

    LMH6321MR/NOPB

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    BUFFER

  • Average Bias Current-Max (IIB):

    17 µA

  • Bandwidth (3dB)-Nom:

    110 MHz

  • Bias Current-Max (IIB) @25C:

    0.015 µA

  • Input Offset Voltage-Max:

    35000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.93 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Min:

    0.3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.68 mm

  • Slew Rate-Nom:

    1800 V/us

  • Supply Current-Max:

    14.5 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    110000

  • Width:

    3.94 mm

LMH6321MR/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMH6321MR involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a low-ESR capacitor for the output filter capacitor.
  • The input capacitor should have a low ESR and be rated for the input voltage. A ceramic capacitor with a value of 1-10uF is a good choice. The output capacitor should also have a low ESR and be rated for the output voltage. A ceramic or tantalum capacitor with a value of 10-100uF is a good choice.
  • The LMH6321MR is rated for operation from -40°C to 125°C, but the maximum ambient temperature range depends on the specific application and the device's power dissipation. It's recommended to derate the device's power dissipation at higher temperatures to ensure reliable operation.
  • The LMH6321MR is a commercial-grade device, but it can be used in high-reliability or aerospace applications with proper qualification and testing. It's recommended to consult with Texas Instruments' application engineers and follow the relevant industry standards and guidelines for high-reliability applications.
  • Common issues with the LMH6321MR can be caused by improper PCB layout, incorrect component selection, or inadequate decoupling. To troubleshoot, check the PCB layout, ensure that the input and output capacitors are properly selected, and add additional decoupling capacitors if necessary. Also, check the device's power supply and input voltage for any anomalies.

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LMH6321MR/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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