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LMH6321MR - Texas Instruments

Description: 300 mA High Speed Buffer

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LMH6321MR - Texas Instruments PCB footprint - Other - Other - SOIC127P620X168-9N
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LMH6321MR - Texas Instruments  - 3D model - Other - SOIC127P620X168-9N
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LMH6321MR Details

  • Manufacturer Part Number:

    LMH6321MR

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    PSOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    BUFFER

  • Average Bias Current-Max (IIB):

    17 µA

  • Bandwidth (3dB)-Nom:

    110 MHz

  • Bias Current-Max (IIB) @25C:

    17 µA

  • Input Offset Voltage-Max:

    52000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e0

  • Length:

    4.93 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Min:

    0.3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.68 mm

  • Slew Rate-Nom:

    2900 V/us

  • Supply Current-Max:

    20.5 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.94 mm

LMH6321MR Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMH6321MR involves keeping the input and output traces short and wide, using a solid ground plane, and placing the decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the output capacitor is properly sized and placed close to the device. Additionally, a low-ESR output capacitor is recommended to minimize ringing and oscillations.
  • The LMH6321MR can handle input voltages up to 42V, but it's recommended to operate within the specified input voltage range of 4.5V to 36V for optimal performance and reliability.
  • The LMH6321MR is rated for operation up to 125°C, but its performance and reliability may degrade at high temperatures. It's recommended to operate the device within the specified temperature range of -40°C to 125°C for optimal performance and reliability.
  • To troubleshoot issues with the LMH6321MR, start by checking the input voltage, output voltage, and current draw. Verify that the device is properly soldered and that the PCB layout meets the recommended guidelines. Use an oscilloscope to check for oscillations or ringing on the output. Consult the datasheet and application notes for more troubleshooting tips.

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LMH6321MR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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