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LMH6321TS/NOPB - Texas Instruments

Description: 300 mA High Speed Buffer with Adjustable Current Limit

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PCB Footprints
LMH6321TS/NOPB - Texas Instruments PCB footprint - Other - Other - KTW0007B
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LMH6321TS/NOPB - Texas Instruments  - 3D model - Other - KTW0007B
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LMH6321TS/NOPB Details

  • Manufacturer Part Number:

    LMH6321TS/NOPB

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    D2PAK

  • Pin Count:

    4

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    BUFFER

  • Average Bias Current-Max (IIB):

    17 µA

  • Bandwidth (3dB)-Nom:

    110 MHz

  • Bias Current-Max (IIB) @25C:

    0.015 µA

  • Input Offset Voltage-Max:

    35000 µV

  • JESD-30 Code:

    R-PSSO-G7

  • JESD-609 Code:

    e3

  • Length:

    10.16 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Min:

    0.3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-263

  • Package Equivalence Code:

    SMSIP7H,.55,50TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.79 mm

  • Slew Rate-Nom:

    1800 V/us

  • Supply Current-Max:

    14.5 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    110000

  • Width:

    8.64 mm

LMH6321TS/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMH6321TS/NOPB involves keeping the input and output traces short and separate, using a solid ground plane, and placing the decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the output capacitor is properly sized and placed close to the device. Additionally, a small series resistor (Rs) can be added to the output to improve stability.
  • The maximum power dissipation of the LMH6321TS/NOPB is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 2.5W at 25°C ambient temperature. However, this can be derated based on the operating temperature and thermal resistance.
  • The LMH6321TS/NOPB is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the power dissipation and ensure proper thermal management to ensure reliable operation in high-temperature environments.
  • To troubleshoot issues with the LMH6321TS/NOPB, start by verifying the input voltage, output voltage, and current. Check for proper PCB layout, decoupling, and component values. Use an oscilloscope to check for oscillations or noise on the output. Consult the datasheet and application notes for guidance on troubleshooting common issues.

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LMH6321TS/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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