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LMH6551QMME/NOPB - Texas Instruments

Description: Texas Instruments LMH6551QMME/NOPB Op Amp, 370MHz, 3 → 11 V, 8-Pin VSSOP

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LMH6551QMME/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK(S-PDSO-G8) HEIGHT= 1.1
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LMH6551QMME/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DGK(S-PDSO-G8) HEIGHT= 1.1
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LMH6551QMME/NOPB Details

  • Manufacturer Part Number:

    LMH6551QMME/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    10 µA

  • Bandwidth (3dB)-Nom:

    300 MHz

  • Bias Current-Max (IIB) @25C:

    10 µA

  • Common-mode Reject Ratio-Min:

    72 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6.6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    2400 V/us

  • Supply Current-Max:

    14.5 mA

  • Supply Voltage Limit-Max:

    6.6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    370000

  • Wideband:

    YES

  • Width:

    3 mm

LMH6551QMME/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMH6551QMME/NOPB involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the device is operated within its recommended operating conditions, and that the input and output impedances are matched properly.
  • The maximum power dissipation of the LMH6551QMME/NOPB is 1.4W. However, this value can be derated based on the ambient temperature and the thermal resistance of the package.
  • The LMH6551QMME/NOPB is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the device's power dissipation and ensure proper thermal management in high-temperature environments.
  • Common issues with the LMH6551QMME/NOPB include oscillations, distortion, and overheating. To troubleshoot these issues, check the PCB layout, component values, and operating conditions. Ensure that the device is operated within its recommended specifications, and that the input and output impedances are matched properly.

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LMH6551QMME/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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