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LMH6559MA/NOPB - Texas Instruments

Description: 1750MHz, High-Speed, Closed-Loop Buffer

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LMH6559MA/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D
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LMH6559MA/NOPB Details

  • Manufacturer Part Number:

    LMH6559MA/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    BUFFER

  • Average Bias Current-Max (IIB):

    14 µA

  • Bandwidth (3dB)-Nom:

    1050 MHz

  • Input Offset Voltage-Max:

    1000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.902 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Min:

    50 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.753 mm

  • Slew Rate-Nom:

    4580 V/us

  • Subcategory:

    Buffer Amplifier

  • Supply Current-Max:

    14 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1750000

  • Width:

    3.899 mm

LMH6559MA/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMH6559MA involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing the decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability in high-gain configurations, it's essential to follow the recommended compensation network and component values, and to ensure that the device is properly bypassed. Additionally, the input and output impedance should be matched to minimize ringing and oscillations.
  • The maximum power dissipation of the LMH6559MA is dependent on the ambient temperature and the thermal resistance of the package. The power dissipation can be calculated using the formula: Pd = (Vcc x Icc) + (Vout x Iout). The maximum power dissipation can be calculated using the thermal resistance and the maximum junction temperature.
  • Yes, the LMH6559MA can be used as a line driver. Key considerations include ensuring that the output impedance is matched to the transmission line, using a suitable output stage configuration, and providing adequate decoupling and bypassing to minimize noise and distortion.
  • To troubleshoot oscillations or instability in the LMH6559MA, check the PCB layout for any issues, ensure that the device is properly bypassed, and verify that the compensation network is correctly implemented. Also, check for any signs of overheating, and ensure that the input and output impedance are properly matched.

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LMH6559MA/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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