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LMH6559MAX/NOPB - Texas Instruments

Description: Operational Amplifiers - Op Amps 1750MHz, High-Speed, Closed-Loop Buffer 8-SOIC -40 to 85

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LMH6559MAX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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LMH6559MAX/NOPB Details

  • Manufacturer Part Number:

    LMH6559MAX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    BUFFER

  • Average Bias Current-Max (IIB):

    14 µA

  • Bandwidth (3dB)-Nom:

    1050 MHz

  • Input Offset Voltage-Max:

    1000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.902 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Min:

    50 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.753 mm

  • Slew Rate-Nom:

    4580 V/us

  • Subcategory:

    Buffer Amplifier

  • Supply Current-Max:

    14 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1750000

  • Width:

    3.899 mm

LMH6559MAX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane, and to keep the input and output traces as short as possible. Additionally, it's recommended to use a common-mode choke or a ferrite bead to filter out high-frequency noise.
  • The choice of output filter components depends on the specific requirements of your application. TI recommends using a combination of resistors, capacitors, and inductors to achieve the desired frequency response. You can use TI's FilterPro software or consult with an applications engineer to determine the optimal component values.
  • The maximum power dissipation of the LMH6559MAX/NOPB is 1.4W. To ensure it doesn't overheat, make sure to provide adequate heat sinking, such as a thermal pad or a heat sink, and keep the ambient temperature below 85°C. You can also use thermal simulation software to estimate the junction temperature and ensure it stays within the recommended range.
  • Yes, the LMH6559MAX/NOPB is qualified for use in high-reliability and aerospace applications. It meets the requirements of various industry standards, including MIL-PRF-38535 and ESCC 9000. However, you should consult with TI's quality and reliability team to ensure that the device meets the specific requirements of your application.
  • TI recommends following a systematic troubleshooting approach, starting with checking the power supply, input and output connections, and PCB layout. You can also use TI's troubleshooting guide and application notes to identify and resolve common issues. If you're still experiencing problems, consult with an applications engineer for further assistance.

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LMH6559MAX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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