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LMH6609MAX/NOPB - Texas Instruments

Description: Operational Amplifiers - Op Amps 900MHz Voltage Feedback Op Amp 8-SOIC -40 to 85

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LMH6609MAX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G8)
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LMH6609MAX/NOPB Details

  • Manufacturer Part Number:

    LMH6609MAX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    3 µA

  • Bandwidth (3dB)-Nom:

    110 MHz

  • Bias Current-Max (IIB) @25C:

    5 µA

  • Common-mode Reject Ratio-Min:

    67 dB

  • Common-mode Reject Ratio-Nom:

    73 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    1.5 µA

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.902 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6.6 V

  • Neg Supply Voltage-Nom (Vsup):

    -3.3 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.753 mm

  • Slew Rate-Min:

    1200 V/us

  • Slew Rate-Nom:

    1400 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    8.5 mA

  • Supply Voltage Limit-Max:

    6.6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    200000

  • Wideband:

    YES

  • Width:

    3.899 mm

LMH6609MAX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-frequency PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using 50-ohm transmission lines for input and output signals.
  • The LMH6609MAX/NOPB requires a specific bias voltage and current to operate optimally. Ensure that the VCC pin is connected to a stable 5V power supply, and the ISET pin is connected to a resistor that sets the desired output current. Refer to the datasheet for specific biasing requirements.
  • The LMH6609MAX/NOPB can handle input signal amplitudes up to 2Vpp differential, but it's recommended to limit the input amplitude to 1.5Vpp to ensure optimal performance and prevent distortion.
  • To reduce noise and jitter, ensure that the power supply is well-regulated and decoupled, use a low-noise reference clock, and minimize the length of the output signal traces. Additionally, consider using a output filter or a clock jitter cleaner to further reduce noise and jitter.
  • While the LMH6609MAX/NOPB is optimized for 50-ohm systems, it can be used in non-50-ohm systems with some adjustments. However, this may require additional impedance matching networks and may affect the device's performance. Consult the datasheet and application notes for more information.

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LMH6609MAX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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