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LMH6629MFE/NOPB - Texas Instruments

Description: Ultra-Low Noise, High-Speed Operational Amplifier with Shutdown

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LMH6629MFE/NOPB - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - LMH6629MFE/NOPB
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LMH6629MFE/NOPB - Texas Instruments  - 3D model - SOT23 (5-Pin) - LMH6629MFE/NOPB
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LMH6629MFE/NOPB Details

  • Manufacturer Part Number:

    LMH6629MFE/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    35 µA

  • Bandwidth (3dB)-Nom:

    190 MHz

  • Bias Current-Max (IIB) @25C:

    0.023 µA

  • Common-mode Reject Ratio-Min:

    82 dB

  • Common-mode Reject Ratio-Nom:

    87 dB

  • Frequency Compensation:

    YES (AVCL>=10)

  • Input Offset Current-Max (IIO):

    1.8 µA

  • Input Offset Voltage-Max:

    780 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    1100 V/us

  • Supply Current-Max:

    16.7 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    4000000

  • Wideband:

    YES

  • Width:

    1.6 mm

LMH6629MFE/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMH6629MFE involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The choice of output filter components depends on the specific application requirements. A good starting point is to use the recommended values in the datasheet, and then adjust based on the desired frequency response and impedance matching. TI also provides a FilterPro software tool to help with filter design.
  • The maximum power dissipation of the LMH6629MFE is 1.4W. To ensure it doesn't overheat, use a heat sink or a thermally conductive PCB material, and ensure good airflow around the device. The device also has a thermal shutdown feature that turns it off if the junction temperature exceeds 150°C.
  • Yes, the LMH6629MFE can be used as a voltage-controlled amplifier by applying a control voltage to the Vgain pin. The gain of the amplifier is proportional to the control voltage, allowing for dynamic gain adjustment.
  • To minimize EMI, use a shielded enclosure, keep the input and output cables short and away from each other, and use ferrite beads or common-mode chokes on the input and output lines. Additionally, ensure good grounding and decoupling of the device.

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LMH6629MFE/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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