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LMH6642MAX/NOPB - Texas Instruments

Description: Single Channel, Low Power, 130MHz, 75mA Rail-to-Rail Output Amplifier

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LMH6642MAX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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LMH6642MAX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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LMH6642MAX/NOPB Details

  • Manufacturer Part Number:

    LMH6642MAX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    2.65 µA

  • Bandwidth (3dB)-Nom:

    46 MHz

  • Bias Current-Max (IIB) @25C:

    2.6 µA

  • Common-mode Reject Ratio-Min:

    72 dB

  • Common-mode Reject Ratio-Nom:

    95 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.8 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    90 V/us

  • Slew Rate-Nom:

    135 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    4.5 mA

  • Supply Voltage Limit-Max:

    13.5 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    19000

  • Voltage Gain-Min:

    3162.278

  • Wideband:

    NO

  • Width:

    3.899 mm

LMH6642MAX/NOPB Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LMH6642MAX/NOPB is 1.4W, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 57.1°C/W.
  • Yes, the LMH6642MAX/NOPB is rated for operation from -40°C to 125°C, making it suitable for high-temperature applications. However, the maximum junction temperature (TJ) should not exceed 150°C.
  • To ensure stability, it's essential to follow proper compensation techniques, such as adding a capacitor in parallel with the feedback resistor (RF) to create a pole-zero pair. Additionally, the datasheet provides guidance on selecting the optimal compensation components.
  • For optimal performance, it's recommended to follow good PCB design practices, such as keeping the input and output traces short and symmetrical, using a solid ground plane, and minimizing parasitic inductance and capacitance. The datasheet provides additional guidance on PCB layout and design considerations.
  • Yes, the LMH6642MAX/NOPB can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is matched to the source impedance to prevent signal attenuation. Additionally, the output impedance of the op-amp should be considered when driving a load.

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LMH6642MAX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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