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LMH6703MF/NOPB - Texas Instruments

Description: 1.2 GHz, Low Distortion Op Amp with Shutdown

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PCB Footprints
LMH6703MF/NOPB - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV0006_A
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LMH6703MF/NOPB - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV0006_A
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LMH6703MF/NOPB Details

  • Manufacturer Part Number:

    LMH6703MF/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    15 µA

  • Bandwidth (3dB)-Nom:

    500 MHz

  • Bias Current-Max (IIB) @25C:

    15 µA

  • Common-mode Reject Ratio-Min:

    45 dB

  • Common-mode Reject Ratio-Nom:

    47 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    7000 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6.75 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    4200 V/us

  • Supply Current-Max:

    12.5 mA

  • Supply Voltage Limit-Max:

    6.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.953 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1800000

  • Wideband:

    YES

  • Width:

    1.6 mm

LMH6703MF/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMH6703MF involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • The output filter components (Rf, Cf, and Lf) should be chosen based on the desired frequency response, output impedance, and power handling. A good starting point is to use the values recommended in the datasheet, and then adjust them based on the specific application requirements.
  • The maximum power dissipation of the LMH6703MF is 1.4W. To ensure it doesn't overheat, make sure to provide adequate heat sinking, use a thermally conductive PCB material, and keep the device away from other heat sources. The junction temperature should be kept below 150°C.
  • Yes, the LMH6703MF can be used in a differential output configuration. This can be achieved by using a transformer or a differential amplifier at the output stage. However, this requires careful design and layout to ensure common-mode rejection and minimize electromagnetic interference.
  • To ensure EMC with the LMH6703MF, use a shielded enclosure, keep the device away from other noise sources, use a common-mode choke at the input, and ensure good PCB layout practices. Additionally, use EMI filters and shielding on the input and output lines as needed.

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LMH6703MF/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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