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LMK316BJ106MLHT - TAIYO YUDEN

Description: Multilayer Ceramic Capacitors MLCC - SMD/SMT FACTORY NOT ACCEPTING ORDERS

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LMK316BJ106MLHT - TAIYO YUDEN PCB footprint - Capacitor Chip Non-polarised - Capacitor Chip Non-polarised - MK316(1206)-2
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LMK316BJ106MLHT - TAIYO YUDEN  - 3D model - Capacitor Chip Non-polarised - MK316(1206)-2
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LMK316BJ106MLHT Details

  • Manufacturer Part Number:

    LMK316BJ106MLHT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    1206

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.24.00.20

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    TAIYO YUDEN

  • YTEOL:

    7

  • Capacitance:

    10 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • Height:

    1.6 mm

  • Length:

    3.2 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Multilayer:

    Yes

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    10 V

  • Reference Standard:

    AEC-Q200

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Temperature Characteristics Code:

    X5R

  • Temperature Coefficient:

    15% ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Width:

    1.6 mm

LMK316BJ106MLHT Frequently Asked Questions (FAQs)

  • The recommended land pattern for LMK316BJ106MLHT is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.15mm.
  • LMK316BJ106MLHT is a moisture-sensitive device and should be stored in a dry environment with a relative humidity of 10% or less. When handling the component, it's recommended to use a dry box or a desiccant pack to maintain a low humidity environment. Baking the component at 125°C for 24 hours can also be done to remove any moisture absorbed during storage.
  • The maximum reflow temperature for LMK316BJ106MLHT is 260°C, with a peak temperature of 255°C. The reflow profile should be set to ensure that the component is exposed to temperatures above 220°C for no more than 60 seconds.
  • Yes, LMK316BJ106MLHT is designed to withstand high-vibration environments. However, it's recommended to follow the manufacturer's guidelines for vibration testing and to ensure that the component is properly secured to the PCB to prevent mechanical stress.
  • To troubleshoot issues with LMK316BJ106MLHT, start by checking the component's soldering quality and ensuring that it is properly seated on the PCB. Check for any signs of physical damage, such as cracks or burn marks. Use a multimeter to measure the component's capacitance and ESR, and compare the results to the datasheet specifications. If the issue persists, contact the manufacturer's technical support for further assistance.

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LMK316BJ106MLHT Overview

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Part Image MG31X106M100CG Walsin Technology Corporation

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Part Image CL31A106MPHGLNC Samsung Electro-Mechanics

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Part Image CL31A106MPHALNE Samsung Electro-Mechanics

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Part Image CL31A106MPHGCNE Samsung Electro-Mechanics

Ceramic Capacitor, Multilayer, Ceramic, 10V, 20% +Tol, 20% -Tol, X5R, 15% TC, 10uF, Surface Mount, 1206

Part Image CL31A106MPHGCNC Samsung Electro-Mechanics

Ceramic Capacitor, Multilayer, Ceramic, 10V, 20% +Tol, 20% -Tol, X5R, 15% TC, 10uF, Surface Mount, 1206

For a full list of alternate parts for LMK316BJ106MLHT, check out Findchips.com