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LMP2231AMFE/NOPB - Texas Instruments

Description: Single Micropower, 1.6V, Precision Operational Amplifier with CMOS Inputs

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PCB Footprints
LMP2231AMFE/NOPB - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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LMP2231AMFE/NOPB - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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LMP2231AMFE/NOPB Details

  • Manufacturer Part Number:

    LMP2231AMFE/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bias Current-Max (IIB) @25C:

    0.000001 µA

  • Common-mode Reject Ratio-Min:

    81 dB

  • Common-mode Reject Ratio-Nom:

    97 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    150 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    32 V/us

  • Slew Rate-Nom:

    0.048 V/us

  • Supply Current-Max:

    0.016 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    130

  • Voltage Gain-Min:

    141000

  • Wideband:

    NO

  • Width:

    1.6 mm

LMP2231AMFE/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 4-layer PCB with a solid ground plane and a thermal relief pattern can also help to dissipate heat efficiently.
  • To ensure stability and prevent oscillations, it's essential to follow proper PCB layout guidelines, use a low-ESR capacitor for the output filter, and ensure that the input and output capacitors are properly decoupled. Additionally, the device's compensation pin should be properly connected to the output capacitor.
  • A low-ESR ceramic capacitor with a value between 1uF to 10uF is recommended for the input capacitor. The capacitor should be placed as close as possible to the device's input pins to minimize noise and ensure proper operation.
  • The output voltage ripple can be calculated using the formula: ΔVout = (Iout * ESL) / (Cout * fsw), where ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency.
  • The maximum ambient temperature range for the LMP2231AMFE/NOPB is -40°C to 125°C. However, the device's junction temperature should not exceed 150°C to ensure reliable operation.

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LMP2231AMFE/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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