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LMP2232BMAX/NOPB - Texas Instruments

Description: Op Amp Dual Precision Amplifier R-R O/P 5.5V 8-Pin SOIC T/R

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LMP2232BMAX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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LMP2232BMAX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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LMP2232BMAX/NOPB Details

  • Manufacturer Part Number:

    LMP2232BMAX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000125 µA

  • Bias Current-Max (IIB) @25C:

    0.000001 µA

  • Common-mode Reject Ratio-Min:

    81 dB

  • Common-mode Reject Ratio-Nom:

    97 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    150 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    32 V/us

  • Slew Rate-Nom:

    0.048 V/us

  • Supply Current-Max:

    0.027 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    130

  • Voltage Gain-Min:

    141000

  • Wideband:

    NO

  • Width:

    3.9 mm

LMP2232BMAX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to minimize thermal resistance. Additionally, placing the device near a thermal pad or heat sink can improve thermal performance.
  • To ensure stability, it's essential to follow the recommended layout and component selection guidelines in the datasheet. Additionally, adding a 10nF to 100nF capacitor between the VIN and GND pins can help to filter out noise and prevent oscillations.
  • The maximum output current of the LMP2232BMAX/NOPB is 3A. However, it's recommended to derate the output current based on the ambient temperature and the thermal performance of the PCB to prevent overheating.
  • The LMP2232BMAX/NOPB is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to follow the recommended operating conditions and derate the output current accordingly to ensure reliable operation.
  • The input capacitor should be a low-ESR ceramic capacitor with a value between 10uF to 22uF. The output capacitor should be a low-ESR ceramic capacitor with a value between 10uF to 47uF. The capacitor selection should be based on the output voltage, output current, and the desired ripple voltage.

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LMP2232BMAX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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