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LMP2232BMME/NOPB - Texas Instruments

Description: Dual, Micropower, 1.6V, Precision , Operational Amplifier with CMOS Input

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LMP2232BMME/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK
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LMP2232BMME/NOPB Details

  • Manufacturer Part Number:

    LMP2232BMME/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000125 µA

  • Bias Current-Max (IIB) @25C:

    0.000001 µA

  • Common-mode Reject Ratio-Min:

    81 dB

  • Common-mode Reject Ratio-Nom:

    97 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    150 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.07 mm

  • Slew Rate-Min:

    32 V/us

  • Slew Rate-Nom:

    0.048 V/us

  • Supply Current-Max:

    0.027 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    130

  • Voltage Gain-Min:

    141000

  • Wideband:

    NO

  • Width:

    3 mm

LMP2232BMME/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer to improve thermal performance. Additionally, it's recommended to use a thermal pad on the underside of the package to connect to the ground plane.
  • To ensure stability in the output voltage, it's recommended to use a minimum output capacitance of 10uF with an ESR of 1 ohm or less. Additionally, the output voltage should be decoupled from the input voltage using a 1uF capacitor.
  • Although the datasheet specifies a maximum input voltage of 15V, it's recommended to limit the input voltage to 12V to ensure reliable operation and to prevent damage to the device.
  • The LMP2232BMME/NOPB has an internal overcurrent protection (OCP) feature that limits the output current to 1.5A. However, it's recommended to add an external current limiting resistor or fuse to protect the device from excessive current draw.
  • A 1uF to 10uF ceramic or film capacitor with an X7R or X5R dielectric is recommended for input decoupling. The capacitor should be placed as close as possible to the input pin of the device.

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LMP2232BMME/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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