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LMP7701MFX - Texas Instruments

Description: OP Amp Single GP R-R I/O 12V 5-Pin SOT-23 T/R

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LMP7701MFX - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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LMP7701MFX - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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LMP7701MFX Details

  • Manufacturer Part Number:

    LMP7701MFX

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Package Description:

    SOT-23, 5 PIN

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0004 µA

  • Bias Current-Max (IIB) @25C:

    0.000001 µA

  • Common-mode Reject Ratio-Min:

    92 dB

  • Common-mode Reject Ratio-Nom:

    138 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    200 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e0

  • Length:

    2.92 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6.6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.22 mm

  • Slew Rate-Nom:

    1 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    1.1 mA

  • Supply Voltage Limit-Max:

    6.6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.953 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    2500

  • Voltage Gain-Min:

    63100

  • Wideband:

    NO

  • Width:

    1.6 mm

LMP7701MFX Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LMP7701MFX involves keeping the input and output traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is also recommended.
  • The LMP7701MFX has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • The maximum power dissipation for the LMP7701MFX is dependent on the ambient temperature and the thermal resistance of the package. For the MSOP package, the maximum power dissipation is approximately 450mW at 25°C ambient temperature.
  • Yes, the LMP7701MFX can be used as a unity-gain buffer. However, it's important to ensure that the input impedance is matched to the source impedance to minimize signal attenuation and distortion.
  • Choose decoupling capacitors with a low equivalent series resistance (ESR) and a high self-resonant frequency (SRF). A 10nF to 100nF ceramic capacitor with an ESR of less than 1 ohm is a good starting point. Place the capacitor close to the device and use a via to connect it to the ground plane.

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LMP7701MFX Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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